Production features of security product boards:
Product Classification: PCBA
Product Name: S800-M
Size: 320mm * 128mm
Pcb sheet information: 6 layers FR4, TG170, plate thickness 1.6MM, copper thickness 1OZ, immersion gold, green oil white, resin plug hole
Pcb industry application: security products
Basic material: 0.1mm copper
Thickness: 1.6 mm
Line width / spacing: 0.15mm / 0.15mm
Surface treatment: ENIG: Au: 0.03-0.09um, Ni: 2-6um
Minimum through hole diameter: 0.2mm
Minimum hole: 0.35mm
Contour tolerance: +/- 0.2mm
Product process description:
Process flow: smt+ packaging
IQc over-furnace experiment: all self-purchased plastic molded patch materials must be reflow soldered
Solder paste requirements: Ag3.0/Cu0.5/20-38uM
A/B surface: first paste the P8 surface, the heavier material bottom non-pad position point on the appropriate amount of red plastic, to prevent the second side when the piece is lost
Reflow soldering temperature setting: Preheating and constant temperature zone operation are based on "Reflow Heater Temperature Management Specification". The maximum temperature of reflow soldering is between 245-247 degrees, and the welding time of over 230 °C is controlled by 40-60S (the temperature of the LED lamp is appropriately reduced (243-245 degrees) when the LED lamp is on one side of the high temperature sensitive oven LED lamp.
No dip process
