Multilayer Printed Circuit Board
Basic information about the product:
Product Classification: PCBA
Product Name: MODLCD LightBarJoin
Pcb sheet information: 4 layers, FR4 TG170, 1.6mm, 1/1/1/1oz, ENIG
Furnace experiment: pcb pad needs to do high temperature test
Pcb board baking: PCB baking 8H, IC needs to bake 8H. (The rest of the IC must be baked 8H as long as it is not a tape package)
AOI testing requirements: check for errors and leaks, check the connector for signs of air bubbles.
Process information for the product:
PCB board manufacturing standard: IPC-A-160 standard, which is the most widely recognized standard for electronic components
Services: Providing complex boards and components, providing OEM services for a variety of printed circuit board assemblies and electronic packaging products, we offer true vertical integration OEM service form procurement, plastic mold/injection, PCB assembly, final housing assembly/testing, Quality assurance of transportation.
PCBA's online testing capabilities
PCBA / SMT / Final Assembly - Vertical Integrated Manufacturing Solutions
Deep understanding of contract manufacturing services
Ability to develop effective production processes to ensure high quality and consistency
Experienced logistics control
Cost-effective factory in China
Flexible production to meet customer demand
Reliable boards for soldering and housing assembly
The overall quality of the assembled product is guaranteed by the quality of the manufactured components
Email us your design and bill of materials to us
Rticle | Description | Capability |
Material | Laminate materials | FR4,Alu,CEM3,Taconic,Rogers |
Board cutting | Number of layers | 1-24 |
Min. Thickness for inner layers (ACu thickness are excluded) | 0.003”(0.07mm) | |
Board thickness | Standard | 0.04-0.16”±10%(0.1-4mm±10%) |
Min. | Single/Double layer: 0.008±0.004” | |
4 layer: 0.01±0.008” | ||
8 layer: 0.01±0.008” | ||
Bow and twist | <7/1000 | |
Copper weight | Outer Cu weight | 0.5-4 oz |
Inner Cu weight | 0.5-3 oz | |
Drilling | Min size | 0.0078” (0.2mm) |
Drill deviation | ±0.002” (0.05mm) | |
PTH hole tolerance | ±0.002” (0.005mm) | |
NPTH hole tolerance | ±0.002” (0.005mm) | |
Plating | Min hole size | 0.0008” (0.02mm) |
Aspect ratio | 20 (5:1) | |
Solder mask | Color | Green,white,black,red,yellow,blue... |
Min solder mask clearanace | 0.003” (0.07mm) | |
Thickness | 0.0005-0.0007”(0.012-0.017mm) | |
Silkscreen | Color | White,black,yellow,red,blue... |
Min size | 0.006” (0.15mm) | |
E-test | Flying Probe Tester | |
Controlled Impedance | Tolerance | ±10% |
Impedance tester | Tektronix TDS8200 | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP... | |
