Photoelectric Detection PCB Assembly Motherboard

Photoelectric Detection PCB Assembly Motherboard

Description of products: This product is a semi-finished product for a customer of our company. The picture is for reference only. The technical parameters are subject to the actual GERBER file!

Product Details

Product information:

Processing type: PCB+ components +SMT+DIP

Processing mode: any way (contractor/raw material/pure processing/processing with supplied materials)

Processing equipment: etching machine + patch machine + wave soldering

Quality certification, ISO9001:2009 / TATF13485 / TATF16949

Manufacturing process: lead-free


PCBA manufacturing capacity:

Maximum plate size: 450*480mm

Maximum plate thickness: 5mm

Minimum part specification: 01005 or 0.2*0.4mm

The heaviest part: 150 grams

Highest part: 25mm

Maximum size of parts: 150*150mm

Minimum pitch: 0.3pitch minimum BGA pitch: 0.2pitch

Maximum mounting accuracy: 25um @ipc actual mounting capacity: 100 million components/month

pcb assembly


Technical parameters :

Minimum line width/spacing: 3mil/3mil

BGA spacing: 0.25 MM

Minimum aperture of finished product: 0.1mm

Maximum size :610mmX1200mm

Thickness: 0.3 3.5 mm

Ink: Japan Tamura, Taiyo photosensitive ink

FR4: built deep, harbor, macro kernel, global, us is, South Asia, yi (yi S1130 / S1141 / S1170), Tg130 ℃ / Tg170 ℃ high TG board)

High frequency board: Rogers, Taconic, ARLLON

Surface technology: tin spraying, lead-free tin spraying, gold precipitation, gold plating of the whole board, gold plating of the plug, chemical precipitation tin (silver), anti-oxidation (OSP) blue glue, carbon oil

Peeling strength: 1.5n /mm

Medium constant: 4.0-4.6

Insulation resistance: 1012 Ω (normal) (normal the conditions)

Thermal shock: 288 ° C 3 xper 10 se conds

Warping: < 0.01mm/mm


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