Description
4 Layer PCB Assembly means there are 4 layers to rout electrical signals: Top Layer, Inner Layer 1, Inner Layer 2 and Bottom Layer. These types of PCBS are increasingly used in situations that require extremely high package density, excellent electrical characteristics, high reliability, and tight volume limits.
Production Service is designed for multi-layer circuits. These PCBs include the green solder mask layers and a white silkscreen layer. This is our best value when ordering large quantities of 4 Layer PCB Assembly, having a low per-square-meter cost and quantity discounts.
Advantages
-Design: It has many circuit layers between Top side and Bottom side of PCB and also each layer can connect with via PTH (Plated Through Hole), this type is more complex than double side PCB.
-With terminal welding plate, 4 Layer PCB Assembly can eliminate the wire head and tin lining, thus saving the cost. Instead of manual soldering of each wire, terminal pads are connected to elements, devices and plugs by dip or wave soldering.
-Eliminates errors in wiring wires and cables. As long as the processed drawing has been proofread and passed, all the winding circuits produced in the future will be the same. No misconnection occurs when connecting wires.
Product Display
About us
1. Our company through IATF16949: 2016 quality system certification, exports of processed products comply with European standards.
2. There is no minimum order quantity restrictions, full support from proofing to batch.
3. Professional component sourcing team, centralized purchasing, you save procurement costs, labor costs, quality costs.
4. Fast Proofing: SMT samples 24 hours of delivery.
5. Our main customer groups: medical, industrial, security, communications, electricity and other high-end.
6.Shenzhen Jingbang technology in the "customers want a little more for our customers to do more to root for quality, service-oriented" service purposes.
Article | Description | Capability |
Material | Laminate materials | FR4,Alu,CEM3,Taconic,Rogers |
Board cutting | Number of layers | 1-58 |
Min. Thickness for inner layers (Cu thickness are excluded) | 0.003”(0.07mm) | |
Board thickness | Standard | 0.04-0.16”±10%(0.1-4mm±10%) |
Min. | Single/Double layer: 0.008±0.004” | |
4 layer: 0.01±0.008” | ||
8 layer: 0.01±0.008” | ||
Bow and twist | <7/1000 | |
Copper weight | Outer Cu weight | 0.5-4 oz |
Inner Cu weight | 0.5-3 oz | |
Drilling | Min size | 0.0078” (0.2mm) |
Drill deviation | ±0.002” (0.05mm) | |
PTH hole tolerance | ±0.002” (0.005mm) | |
NPTH hole tolerance | ±0.002” (0.005mm) | |
Plating | Min hole size | 0.0008” (0.02mm) |
Aspect ratio | 20 (5:1) | |
Solder mask | Color | Green,white,black,red,yellow,blue... |
Min solder mask clearanace | 0.003” (0.07mm) | |
Thickness | 0.0005-0.0007”(0.012-0.017mm) | |
Silkscreen | Color | White,black,yellow,red,blue... |
Min size | 0.006” (0.15mm) | |
E-test | Flying Probe Tester | Y |
Controlled Impedance | Tolerance | ±10% |
Impedance tester | Tektronix TDS8200 | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP... |
