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How to maintain RoHS during PCB Assembly
China FastPCBA has been expertise in PCB Assembly Prototyping process for years. How to make sure that the PCBAs are compliance with RoHS.
Here are major tips to maintain RoHS (HASL lead-free) or NON-RoHS (HASL):
1. From Printed Circuit Board Substrate Base view:
Be separated the HASL Lead-Free PCBs from HASL boards as request. FR4 material is divided into layers because of higher temperature requirements for lead-free reflow process. If rework or both-sided SMT soldering is required, high temperature issue is magnified because the PCB will be reheated multiple times in the reflow oven. More caution should be taken especially for through-hole parts. Tips: all of our FastPCBAs’ boards are lead-free basis.
2. RoHS Compliant Components:
Make sure there are no prohibited materials for RoHS compliance components. When stating RoHS compliance components in the Bill of Materials (BOM), the components provided in the kit be RoHS compliance. Since we have strict supplier-chain management, we can fully trust and make sure that the components are compliance with RoHS.
3. From Moisture Sensitive Components protecting view:
Over a period of time, the components absorb water in small quantities. Packages try to limit water absorption and therefore an expiration date and storage condition be listed up. Expired component or a component with opening package can destroy itself during reflow processing and can lead to cracks. So, opening package components can be used for production only under the condition that baking or slow heating the components.
We are responsible to say that baking boards before production &to store sensitive components into the moisture buster cabinet with specified temperature and humidity, is one of our basic process.
We recently even hold a particular meeting to re-ensure that we are fully COMPLIANCE with RoHS.