Quick Turn Multilayer PCB Assembly's conformal coating provides dip coating and vertical coating. Its coating protects printed circuit board assemblies to protect electronic components from damage caused by harsh or extreme environments, salt spray, moisture, fungus, dust and corrosion. The coating is clearly visible and is a transparent and shiny material. It has a rapid prototyping, high mixing, low and medium volume construction.
2. The surface mount technology used in Quick Turn Multilayer PCB Assembly is a circuit assembly technique. This technique is a method of mounting chip components on the surface of a printed circuit board by soldering and assembling reflow or dip soldering. It achieves high density, high reliability, miniaturization and low cost of assembly. This Quick Turn Multilayer PCB Assembly has high density, small size, light weight, reliability, strong shock resistance and low solder joint defect rate. In addition, it can effectively reduce electromagnetic interference and radio frequency.