Surface Mount SMT PCB Assembly

Surface Mount SMT PCB Assembly

Surface Mount SMT PCB Assembly is one of the most popular electronic product assembly methods. It is a new generation of electronic assembly technology that compresses traditional electronic components into devices that are only a few tenths of a volume. Thereby achieving high density, high reliability, miniaturization, low cost and automation of production of PCB proofing electronic product assembly.

Product Details

pcb order prototype smt assembly

pcb assembly.jpg

Specification:

AticleDescriptionCapability
MaterialLaminate materialFR4, Alu, CEM3,Taconic,Rogers
Board cuttingNumber of layers1-58

Min.Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)
Board thicknessStandard0.04-0.16''±10%(0.1-4mm±10%)
MinSingle/Double layer:0.008±0.004''
Bow and twist<7/1000
Copper weightouter Cu weight 0.5-4 oz
inner Cu weight 0.5-3 oz
Drilling
Min size0.0078''(0.2mm)
Drill deviation±0.002''(0.05mm)
PTH hole tolerance±0.002''(0.005mm)
NPTH Hole tolerance±0.002''(0.005mm)
PlatingMin hole size
0.0008''(0.02mm)
Aspect ratio20(5 :1)
Solder maskColorGreen,white,black,red,yellow,blue
Min solder mask clearance0.003''(0.07mm)
Thickness0.0005-0.0007''(0.012-0.017mm)

Description:

Surface Mount SMT PCB Assembly is one of the most popular electronic product assembly methods. It is a new generation of electronic assembly technology that compresses traditional electronic components into devices that are only a few tenths of a volume. Thereby achieving high density, high reliability, miniaturization, low cost and automation of production of PCB proofing electronic product assembly.


Characteristics:

The assembly density is high, the size of the electronic product is small, and the weight is light. The volume and weight of the chip components are only about 1/10 of that of the conventional plug-in components. After the SMT is generally used, the volume of the electronic product is reduced by 40% to 60%, and the weight is reduced by 60%. 80%.

High reliability and strong anti-vibration ability. The solder joint defect rate is low.

High frequency characteristics are good. Reduced electromagnetic and radio frequency interference.

Easy to automate and increase productivity. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.

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