Production basic information
Product Name: 14 layers FR4, TG170, plate thickness 2.54MM, copper thickness 1OZ, immersion gold, blue oil white, single piece size 59.94*66.45MM
Application: Suitable for all industries
Mechanical rigidity: rigid pcb
Material: Glass fiber epoxy resin
Flame retardant performance: V0
Processing technology: electrolytic foil
Insulation material: epoxy resin
Surface treatment: three anti-paint
Number of floors: 8 layers
Inspection requirements: General standard implementation IPC-610E-2 level All PCB boards with BGA ICs must be X-RAY to see if BGA IC has poor soldering. BGA IC is well soldered for normal production, every hour in production. Left and right to sample more than one Zhao X-RAY to see the BGA IC welding conditions, BGAIC welding is good to normal production.
Welding method: hand soldering, soldering iron temperature 370 degrees, tin penetration 50%
Cleaning method: electrostatically brush the board, taking care not to corrode the internal contacts of the connector.
Product transportation and packaging: The white box cotton should be protected around the carton, and it should have the effect of shockproof, anti-collision and anti-fall.
We are a PCB manufacturer in Shenzhen, China, providing PCBs with sincere service and competitive prices for various technology industries.
More importantly, we can save you more time and cost. Please feel free to send us your enquiry.
We have passed SGS, ISO9001, ISO13485 and UL certification.
Please feel free to contact us if you need it.
Phone: +86 75526978877