pcb manufacturing process fast pcb
|Material||Laminate material||FR4, Alu, CEM3,Taconic,Rogers|
|Board cutting||Number of layers||1-58|
Min.Thickness for inner layers
(Cu thickness are excluded)
|Bow and twist||<7/1000|
|Copper weight||outer Cu weight||0.5-4 oz|
|inner Cu weight||0.5-3 oz|
|PTH hole tolerance||±0.002''(0.005mm)|
|NPTH Hole tolerance||±0.002''(0.005mm)|
|Plating||Min hole size||0.0008''（0.02mm）|
|Aspect ratio||20(5 :1)|
|Min solder mask clearance||0.003''(0.07mm)|
|E-test||Flying probe tester||Y|
|Impedance tester||Tektronix TDS8200|
|Surface finish||HASL,ENIG,immersion silver，immersion tin, OSP.|
Fast Pcb prototype Manufacturing can be made from a variety of different materials. The most widely used form of fiberglass substrate called FR4. This provides a reasonable degree of stability under steady temperature changes that are not severely broken, although not excessively expensive. Other less expensive materials can be used in printed circuit boards for low cost commercial products. The dielectric constant of substrates in high performance RF designs is important and requires low levels of loss, and then Teflon-based printed circuit boards can be used, although they are more difficult to handle.
In order to make the track with the component in the PCB, the copper clad plate is first obtained. This is included on the substrate material, usually FR4, on both sides of the usual copper cladding. The copper coating is attached to a thin layer of copper on the main board. This combination is usually very good for FR4, but the nature of PTFE makes this more difficult, which adds to the difficulty of processing PTFE PCBs.
Choosing and providing the next step with bare PCB boards is to create the required traces on the board and remove unwanted copper. The use of a chemical etching process in the fabrication of the PCB is typically accomplished. The most common form of PCB use etching is ferric chloride.
In order to get the correct mode of the track, use the photography process. Copper is usually covered on the bare printed circuit board with a thin layer of photoresist. It then details the desired track exposure through photographic film or photomask. An image of the track in this manner is delivered to the photoresist. When this is done, the photoresist is placed on the developer so that only those areas of the track plate that are needed are covered by the resist.