Fast Pcb prototype Manufacturing

Fast Pcb prototype Manufacturing

Fast Pcb prototype Manufacturing can be made from a variety of different materials. The most widely used form of fiberglass substrate called FR4. This provides a reasonable degree of stability under steady temperature changes that are not severely broken, although not excessively expensive.

Product Details

Pcb manufacturing process fast pcb


pcba

Specification:


Aticle

Description

Capability

Material

Laminate material

FR4, Alu, CEM3,Taconic,Rogers

Board cutting

Number of layers

1-58

Min.Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)

Board thickness

Standard

0.04-0.16''±10%(0.1-4mm±10%)

Min

Single/Double layer:0.008±0.004''

Bow and twist

<7/1000

Copper weight

outer Cu weight 

0.5-4 oz

inner Cu weight 

0.5-3 oz

Drilling

Min size

0.0078''(0.2mm)

Drill deviation

±0.002''(0.05mm)

PTH hole tolerance

±0.002''(0.005mm)

NPTH Hole tolerance

±0.002''(0.005mm)

Plating

Min hole size

0.0008''(0.02mm)

Aspect ratio

20(5 :1)

Solder mask

Color

Green,white,black,red,yellow,blue

Min solder mask clearance

0.003''(0.07mm)

Thickness

0.0005-0.0007''(0.012-0.017mm)

Silkscreen

Color 

Green,white,black,red,blue....

Min size

0.006''(0.15mm)

E-test

Flying probe tester

Y

Controlled Impedance

Tolerance

±10%

Impedance tester

Tektronix TDS8200

Surface finish

HASL,ENIG,immersion silver,immersion tin, OSP.


Description:

Fast Pcb prototype Manufacturing can be made from a variety of different materials. The most widely used form of fiberglass substrate called FR4. This provides a reasonable degree of stability under steady temperature changes that are not severely broken, although not excessively expensive. Other less expensive materials can be used in printed circuit boards for low cost commercial products. The dielectric constant of substrates in high performance RF designs is important and requires low levels of loss, and then Teflon-based printed circuit boards can be used, although they are more difficult to handle.

In order to make the track with the component in the PCB, the copper clad plate is first obtained. This is included on the substrate material, usually FR4, on both sides of the usual copper cladding. The copper coating is attached to a thin layer of copper on the main board. This combination is usually very good for FR4, but the nature of PTFE makes this more difficult, which adds to the difficulty of processing PTFE PCBs.



PCB (2)



Choosing and providing the next step with bare PCB boards is to create the required traces on the board and remove unwanted copper. The use of a chemical etching process in the fabrication of the PCB is typically accomplished. The most common form of PCB use etching is ferric chloride.

In order to get the correct mode of the track, use the photography process. Copper is usually covered on the bare printed circuit board with a thin layer of photoresist. It then details the desired track exposure through photographic film or photomask. An image of the track in this manner is delivered to the photoresist. When this is done, the photoresist is placed on the developer so that only those areas of the track plate that are needed are covered by the resist.


PCB prototype



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