Pcb Manufacturing And Assembly

Pcb Manufacturing And Assembly

FASTPCBA Technology Co.,Ltd is a competitive China Pcb Manufacturing And Assembly OEM manufacturer, supplier and vendor, you can get quick turn Pcb Manufacturing And Assembly production prototypes and samples from our factory.

Product Details

Pcb manufacturing and assembly pcb design


pcba


Specification:


Aticle

Description

Capability

Material

Laminate material

FR4, Alu, CEM3,Taconic,Rogers

Board cutting

Number of layers

1-58

Min.Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)

Board thickness

Standard

0.04-0.16''±10%(0.1-4mm±10%)

Min

Single/Double layer:0.008±0.004''

Bow and twist

<7/1000

Copper weight

outer Cu weight 

0.5-4 oz

inner Cu weight 

0.5-3 oz

Drilling

Min size

0.0078''(0.2mm)

Drill deviation

±0.002''(0.05mm)

PTH hole tolerance

±0.002''(0.005mm)

NPTH Hole tolerance

±0.002''(0.005mm)

Plating

Min hole size

0.0008''(0.02mm)

Aspect ratio

20(5 :1)

Solder mask

Color

Green,white,black,red,yellow,blue

Min solder mask clearance

0.003''(0.07mm)

Thickness

0.0005-0.0007''(0.012-0.017mm)

Silkscreen

Color 

Green,white,black,red,blue....

Min size

0.006''(0.15mm)

E-test

Flying probe tester

Y

Controlled Impedance

Tolerance

±10%

Impedance tester

Tektronix TDS8200

Surface finish

HASL,ENIG,immersion silver,immersion tin, OSP....


Description:

The substrate of the PCB is generally glass fiber. In most cases, the fiberglass substrate of a PCB is generally referred to as the "FR4" material. The solid material "FR4" gives the hardness and thickness of the PCB. In addition to the FR4 substrate, there are flexible circuit boards produced on flexible high-temperature plastics (polyimide or the like) and the like.


Printed boards have evolved from single layers to double-sided, multi-layer and flexible, and still maintain their respective trends. Due to the continuous development of high precision, high density and high reliability, the volume is reduced, the cost is reduced, and the performance is improved, so that the printed board still maintains a strong vitality in the development of electronic equipment in the future.

PCB prototype



Factory production of printed circuit boards requires a cumbersome process. In the production process, each technology has a clear method of operation. In addition to making the film, hole metallization and pattern plating etching are the key to production. The original method of making the printed circuit board: For the printed circuit board, the method must meet the quality requirements of the 1:1 original film, and also the original film should be refurbished to produce the film, the original film has two sources. One is to make a photographic base map, and the original negative film is obtained after photographing. One is to directly draw the original negative film by computer aided system and photoplotter, PCB printing and etching and process: resist pattern or electroplating mask pattern There are two general methods: screen printing and photo-drying. The screen printing method is generally used for single-sided or double-sided PCB production with large batch size and low single precision, which is convenient for automation. The photosensitive dry film method is mainly to improve production efficiency, simplify the process, and improve the quality of the board.


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