Product basic information:
Goods classification: PCBA
Product Name: GIN-SAM4-2.0
pcb industry application: body dryer
Production process: lead-free process
Production process: smt, dip, burning, testing, packaging
Solder paste requirements: Ag3.0 / Cu0.5 / 20-38uM
Double-sided patch: IC48 surface is affixed first, pay attention to check the X30-bit patch memory slot. If there is a virtual soldering phenomenon, please add adhesive paper on the steel net to increase the amount of tin to prevent the virtual soldering.
X-ray is used to check the soldering of BGA IC for the first 3 pieces. X-ray sampling is used to check the soldering of BGA IC for every 50 pieces.
The PCB boards are the same, but some materials are not the same. Make sure to distinguish the whole process during production and don't get confused.
Welding method: manual soldering, soldering iron temperature 370 degrees, tin penetration 50% or more
Product packaging: red bubble roll packaging, each sentence can not exceed 5