Basic information about telecommunications circuit board products:
Substrate for board: FR4, FR1, CEM3, aluminum, Cer
Copper thickness on pcb surface: 1oz~4oz
Pcb board thickness: 0.5~3.2mm
Minimum opening size: 0.15mm
Minimum line width: 0.08mm
Surface treatment process: HASL process
Number of floors: 8 layers
Maximum panel size: 541 * 647mm
Finished hole size: PTH +/- 0.003'', NPTH +/- 0.002
Hole position accuracy: +/- 0.003"
Annular space: minimum 0.1mm
Aspect ratio: minimum 1:8
Solder mask registration: +/- 0.003"
Layer-to-layer registration: +/- 0.003"
Minimum electroplated copper drill: 0.25mm, 0.233mm
1.HASL(Hot Air Solder Leveling) Surface Finishing Technology.
2.Single board/2 Layer/Multilayer OEM&ODM Printed Circuit Board.
3. Famous Brand, Quality Guaranteed.
4. 100% Functional Tested.
5. UL,RoHS, SGS, ISO9001, ISO14001 Certificated.
6. Short Leadtime and Fast Delivery
7. NDA Signment
8. Any Question will be Replied ASAP(within 24 hours).
Here is the best choice for you, Single board/2 Layer/Multilayer FR-4 Based PCB Board with 1.6mm Board Thickness & HASL surface finishing technology, We also make particular specification PCB/PCBA as you demand.
Parameter table of production capacity: