Electrostatic Prototype Multilayer Printed Circuit Board is a separate board with interconnected electrical and electronic components. The circuit is produced by a layer of slightly conductive material deposited on the outside of an insulating plate called a substrate. Separate components are located on the surface of the substrate and soldered to the connected circuitry. Electrostatic Prototype Multilayer Printed Circuit Board's construction is multifaceted. The components above Electrostatic Prototype Multilayer Printed Circuit Board are electrically connected to the circuit in two different ways, such as hole technology and surface mount. In the hole technique, each component consists of thin leads that are pressed through a small hole in the substrate and soldered to the connection plate in the back circuit. In surface mount technology, the J- or L-shaped terminals on each component are in direct contact with the PCB. The solder paste includes glue, flux and flux applied at the contact points to hold the components in place until the solder liquefies.