Basic information of copper circuit boards
Product Classification: PCB Technology for Copper
Pcb sheet information: 6 layers FR4, TG170, board thickness 2.0MM, copper thickness 1OZ, immersion gold, single piece size 58*58MM, vias in the center of the patch pad
Product Name: PCB_APR2019_v1.0
Industrial applications of pcb: digital products, computers with LCD screens
Flame retardant performance: V0
Copper thickness: 0.5-2oz
Structure: double-sided pcba
Number of floors: 6 layers
Mass production: Yes, confirm after confirming the sample
Place of Origin: Shenzhen, Guangdong
Product description of the board
Double-sided copper circuit boards are widely used in aerospace, military, mobile communications, notebook computers, computer peripherals, PDAs, digital cameras and other fields or products.
Bare copper itself has good solderability but is easily oxidized. In order to ensure good solderability and electrical properties, we need to carry out various surface treatment processes.
The actual surface treatment process of double-sided copper circuit boards can be divided into OSP, tin spray (lead and lead-free), sink tin, immersion gold, immersion silver, nickel immersion gold, nickel palladium immersion gold, electroplated hard gold. , all gold plated, gold fingers and so on.
Copper double panel product features
(1) It can be bent, wound and folded, and can be arbitrarily arranged according to the spatial layout requirements, and can be arbitrarily moved and expanded in a three-dimensional space, thereby realizing integration of component assembly and wire connection.
(2) Double-sided copper circuit board can greatly reduce the size and weight of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability.
(3) The double-sided copper circuit board also has the advantages of good heat dissipation and solderability, easy installation and connection, and low overall cost. The combination of soft and hard design also compensates for the lack of design of the flexible substrate. The bearing capacity of the components is to some extent.