*Lcd Tv Circuit Board Assembly features Organic Solderability Preservative (Organic Solderability Preservative), which is to grow a layer of complex compound on the surface of copper by means of chemistry. This organic skin film can protect the clean bare copper on the board from rust (vulcanization or oxidation) when it is no longer in contact with air in normal storage environment, and can be easily removed by flux and dilute acid during PCBA board assembly, exposing the clean copper surface to be welded with molten solder.
*Organic copper shield agent (OSP) if just with holes on the copper, copper surface oxidation will start from hole, which affect the SMT assembly, and the thickness of the organic copper protection agent is thicker, for copper foil protective is better, but relatively also need strong active flux can remove it for welding, so the general requirements OSP film thickness between 0.2 0.5 um.
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