Basic information about the product process:
Pcb board model: EM32DI-E4 V0.2
Production process: SMT, DIP, packaging
Solder paste requirements: Gaoletai: Sn96.5/Ag3/Cu0.5/20~38wm
Inspection requirements for pcb board: Check the error and leakage of the virtual connection, X-ray regularly check the BGA welding effect, sampling more than 20%.
Component cutting foot requirements: cutting foot length: 1.2mm-2.0mm
The requirements of the board: the attention of the board can not hurt the components
Inspection requirements: Whether the components in the polarity direction are reversed, and whether the connector is floating in the reverse direction, whether there is tin or tin
Packing and shipping:
1) This product is extremely sensitive to static electricity. Please strictly carry out product packaging and anti-static measures.
2) Avoid product collision during packaging and transportation.
We are able to provide cost-effective, high-quality pcba manufacturing services from PCB assembly to final housing assembly:
Onboard chip (COB)
Surface Mount Technology (SMT)
Ball grid array (BGA)
Main competitive advantages:
Deep understanding of pcb manufacturing services
Ability to develop effective production processes to ensure high quality and consistency
Experienced logistics management
Cost-effective factory is located in mainland China
Flexible handling of small batches and high volume production
Since January 2002, we have also launched six Sigma DMAIC programs.
Our range of building products experience: industrial, automotive, computer, storage, consumer, instrumentation, medical, networking, peripherals and telecommunications
Minimum order quantity: 1 piece