Utilizing state-of-the-art auto insertion equipment and hand insertion techniques to assemble 8 Layer Fine Pitch PCB for Communication Product. Hand soldering was also employed, using a lead free solder. Made with precision surface mount and thru hole mounting technologies, the board had 8 layers, a package size range of 0603, and fine pitch spacing for specified LGA, BGA, and QFN packages.
It is a main part of multilayer PCBs and directly helps to save PCB real estate up to 50% for fine pitch BGA and flip chip components. Our 8 Layer Fine Pitch PCB are widely applied for home appliance, consumer electronics, industrial, automotive, medical, computing, storage, instrumentation, traffic, industrial power, battery, fire alarm, CCTV, wireless communication, telecommunication, networking, printer
Banking on the skills of our qualified team of professionals, we are involved in offering supreme quality array of 8 Layer Fine Pitch PCB for Communication Product. We have professional QC system, and checked the products one by one, so that we can make sure the products with the high quality. If you have any questions about our products, please feel free to contact us, we will be the first time to reply.
*Underwriters Laboratories (UL)
Sunstone can mark product with our UL 796 marking (File # ZPMV2.E58527) to show compliance for flammability, and delamination. This service is available online or through Custom Quote.
Sunstone is registered with the DDTC (Directorate of Defense Trade Controls) for compliance to handle ITAR requirements. This service is available online or through Custom Quote.