Customized elevator circuit board

Customized elevator circuit board

FASTPCBA Technology Co.,Ltd is a competitive China Customized elevator circuit board OEM manufacturer, supplier and vendor, you can get quick turn Aluminium Oxide Ceramic PCB production prototypes and samples from our factory.

Product Details

Customized elevator circuit board

pcb assembly .jpg


Specification:

Aticle

Description

Capability

Material

Laminate material

FR4, Alu, CEM3,Taconic,Rogers

Board cutting

Number of layers

1-58

Min.Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)

Board thickness

Standard

0.04-0.16''±10%(0.1-4mm±10%)

Min

Single/Double layer:0.008±0.004''

Bow and twist

<7/1000

Copper weight

outer Cu weight 

0.5-4 oz

inner Cu weight 

0.5-3 oz

Drilling

Min size

0.0078''(0.2mm)

Drill deviation

±0.002''(0.05mm)

PTH hole tolerance

±0.002''(0.005mm)

NPTH Hole tolerance

±0.002''(0.005mm)

Plating

Min hole size

0.0008''(0.02mm)

Aspect ratio

20(5 :1)

Solder mask

Color

Green,white,black,red,yellow,blue

Min solder mask clearance

0.003''(0.07mm)

Thickness

0.0005-0.0007''(0.012-0.017mm)

Silkscreen

Color 

Green,white,black,red,blue....

Min size

0.006''(0.15mm)

E-test

Flying probe tester

Y

Controlled Impedance

Tolerance

±10%

Impedance tester

Tektronix TDS8200

Surface finish

HASL,ENIG,immersion silver,immersion tin, OSP....


Description:

Aluminium Oxide Ceramic PCB refers to a special process board in which copper foil is directly bonded to the surface of aluminum oxide (Al2O3) ceramic substrate (single or double sided) at high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current. ability. Therefore, ceramic circuit boards have become the basic material for high-power power electronic circuit structure technology and interconnection technology. Wide range of applications, for high-power equipment, IC MOS tubes, IGBT chip-type thermal insulation, high-frequency power, communications, mechanical equipment, high-current, high-voltage, high-temperature and other products that require thermal and thermal insulation.


pcba


In order to improve the problem of the thick film process and the shrinkage ratio after multi-layer pressure sintering, an alumina thin film ceramic substrate has recently been developed as a heat sink substrate. The aluminum oxide film heat sink substrate is fabricated by sputtering, electro/electrochemical deposition, and yellow light lithography.

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