Aluminium Oxide Ceramic PCB

Aluminium Oxide Ceramic PCB

Aluminium Oxide Ceramic PCB refers to a special process board in which copper foil is directly bonded to the surface of aluminum oxide (Al2O3) ceramic substrate (single or double sided) at high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current. ability.

Product Details

Customized elevator circuit board

pcb assembly .jpg

Specification:

AticleDescriptionCapability
MaterialLaminate materialFR4, Alu, CEM3,Taconic,Rogers
Board cuttingNumber of layers1-58

Min.Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)
Board thicknessStandard0.04-0.16''±10%(0.1-4mm±10%)
MinSingle/Double layer:0.008±0.004''
Bow and twist<7/1000
Copper weightouter Cu weight 0.5-4 oz
inner Cu weight 0.5-3 oz
Drilling
Min size0.0078''(0.2mm)
Drill deviation±0.002''(0.05mm)
PTH hole tolerance±0.002''(0.005mm)
NPTH Hole tolerance±0.002''(0.005mm)
PlatingMin hole size
0.0008''(0.02mm)
Aspect ratio20(5 :1)
Solder maskColorGreen,white,black,red,yellow,blue
Min solder mask clearance0.003''(0.07mm)
Thickness0.0005-0.0007''(0.012-0.017mm)
SilkscreenColor Green,white,black,red,blue....
Min size0.006''(0.15mm)
E-testFlying probe testerY
Controlled Impedance
Tolerance±10%
Impedance testerTektronix TDS8200
Surface finishHASL,ENIG,immersion silver,immersion tin, OSP....


Description:

Aluminium Oxide Ceramic PCB refers to a special process board in which copper foil is directly bonded to the surface of aluminum oxide (Al2O3) ceramic substrate (single or double sided) at high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current. ability. Therefore, ceramic circuit boards have become the basic material for high-power power electronic circuit structure technology and interconnection technology. Wide range of applications, for high-power equipment, IC MOS tubes, IGBT chip-type thermal insulation, high-frequency power, communications, mechanical equipment, high-current, high-voltage, high-temperature and other products that require thermal and thermal insulation.

In order to improve the problem of the thick film process and the shrinkage ratio after multi-layer pressure sintering, an alumina thin film ceramic substrate has recently been developed as a heat sink substrate. The aluminum oxide film heat sink substrate is fabricated by sputtering, electro/electrochemical deposition, and yellow light lithography.

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