1. This Integrated Copper Combined pcb has an integrated design and partial mixing pressure. Its surface treatment uses HASL (lead-free), OSP, ENIG, ENEPIG, immersion silver, immersion tin, hard gold plating, tin plating, silver plating. HASL immerses the board in a tin/lead alloy bath and then uses an “air knife” to remove excess solder and blow hot air across the board surface.
2. The OSP that Integrated Copper Combined pcb uses protects the copper surface from oxidation by applying a very thin protective layer of material on the exposed copper using a conveyor process. ENIG is a two-layer metal coating containing 2-8 μin Au and 120-240 μin Ni. Nickel is the barrier to copper and is the surface to which the component is actually soldered. Gold protects nickel during storage and also provides the low contact resistance required for thin gold deposits.
3. Immersion Tin (ISn) is a metal structure deposited by a chemical displacement reaction that is applied directly to the base metal of the board, ie copper. The underlying copper of ISn protection is not oxidized during its expected shelf life. In addition, the other surface treatment methods that Integrated Copper Combined pcb uses also have a good effect on it.