Product introduction of high frequency instrument circuit board pcb:
1. The high frequency instrument board has an integrated design and partial mixing pressure. Its surface treatment uses HASL (lead-free), OSP, ENIG, ENEPIG, immersion silver, immersion tin, hard gold plating, tin plating, silver plating. HASL immerses the board in a tin/lead alloy bath and then uses an “air knife” to remove excess solder and blow hot air across the board surface.
2. The OSP process used in high-frequency instrumentation boards is characterized by the use of a conveyor belt process to protect the copper surface from oxidation by applying a very thin layer of material to the exposed copper. ENIG is a two-layer metal coating containing 2-8 μin of Au and 120-240 μin of nickel. Nickel is a barrier to copper and is the surface to which the component is actually soldered. Gold protects nickel during storage and provides the low contact resistance required for thin gold deposition.
3. Immersion tin (ISn) is a metal structure deposited by a chemical displacement reaction and can be directly applied to a base metal (ie, copper) of a plate. The underlying copper protected by ISn will not be oxidized during its expected shelf life. In addition, other surface treatment methods used in integrated copper composite printed circuit boards also have good results.
Our pcb manufacturing has passed the certification: UL, RoHS, ISO 9001, IATF16949, ISO13485 certification. Therefore, our quality is guaranteed.
The PCB assembly we require requires the following information:
1. PCB bare board Gerber file
2. BOM (bill of materials) for assembly
In order to shorten the lead time of the components, please let us know if there are acceptable alternatives.
3. Necessary test guides and test fixtures
4. Programming files and programming tools when necessary
5. Schematic diagram if necessary