custom pcb printed circuit board supplier
|Material||Laminate material||FR4, Alu, CEM3,Taconic,Rogers|
|Board cutting||Number of layers||1-58|
Min.Thickness for inner layers
(Cu thickness are excluded)
|Bow and twist||<7/1000|
|Copper weight||outer Cu weight||0.5-4 oz|
|inner Cu weight||0.5-3 oz|
|PTH hole tolerance||±0.002''(0.005mm)|
|NPTH Hole tolerance||±0.002''(0.005mm)|
|Plating||Min hole size||0.0008''（0.02mm）|
|Aspect ratio||20(5 :1)|
|Min solder mask clearance||0.003''(0.07mm)|
|E-test||Flying probe tester||Y|
|Impedance tester||Tektronix TDS8200|
|Surface finish||HASL,ENIG,immersion silver，immersion tin, OSP....|
Unlike traditional materials, Electronic ceramic printed circuit board have good high-frequency performance and electrical properties, and have high thermal conductivity, excellent chemical stability and thermal stability, and are not available in organic substrates. The ideal packaging material for power electronics modules.
Electronic ceramic printed circuit board are actually made of electronic ceramics and can be made into various shapes. Among them, ceramic circuit boards have the most outstanding characteristics of high temperature resistance and high electrical insulation performance, and have the advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient of components. Ceramic circuit boards are produced using LAM technology, a laser rapid activation metallization technology. Used in LED field, high power power semiconductor module, semiconductor cooler, electronic heater, power control circuit, power mixing circuit, intelligent power component, high frequency switching power supply, solid state relay, automotive electronics, communication, aerospace and military electronics Component.
1. Higher thermal conductivity
2. More matching coefficient of thermal expansion
3. Stronger, lower resistance metal film
4. The solderability of the substrate is good and the use temperature is high.
5. Good insulation
6. Low frequency loss
7. Can be assembled in high density
8. Free of organic components, resistant to cosmic rays, high reliability in aerospace and long service life
9. The copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere.