Communication Data Acquisition FR4 94V0 PCB

Communication Data Acquisition FR4 94V0 PCB

Communication data acquisition PCBA craft requirements: 1. Commodity code: SSX2305A0-PCBA 2, PCBA size: 560 * 320mm / 100pcs 3, layer / material / thickness: 8 layers / high TG material / 0.6mm 4, process flow: SMT + DIP + components 5, craftsmanship: solder paste lead-free 6, need to test...

Product Details


Communication data acquisition PCBA craft requirements:

1. Commodity code: SSX2305A0-PCBA

2, PCBA size: 560 * 320mm / 100pcs

3, layer / material / thickness: 8 layers / high TG material / 0.6mm

4, process flow: SMT + DIP + components

5, craftsmanship: solder paste lead-free

6, need to test materials

7, IC prenatal burning

8. Is there a special sensitive device: none

9, A / B surface: single-sided patch

10 through tin requirements: solder joints must be fully welded.


Production process:


 pcb circuit




The reference price of this product (the price is composed of PCB + components +pcba+ engineering fee, and the actual price is subject to the information provided by the customer) : 


Type

Production  serial number 

Specification

Customer mode

Quantity 

Unit price

Engineering fee

mesh fee

mould fee

total amount

pcb

Pick Place for Ext_ICEOK140930

2J0602A0

Project Outputs for XJ_RF_Generator

400

60

--

24000

pcba assembly

Pick Place for Ext_ICEOK140930

2J0602A0

Project Outputs for XJ_RF_Generator

400

0.35

--

140

Electronic Components

Pick Place for Ext_ICEOK140930

2J0602A0

Project Outputs for XJ_RF_Generator

400

8

--

3200

 test

Pick Place for Ext_ICEOK140930

2J0602A0

Project Outputs for XJ_RF_Generator

400

60

--

24000

 packaging

Pick Place for Ext_ICEOK140930

2J0602A0

Project Outputs for XJ_RF_Generator

400

2.6

1040



Total unit price

:

¥52380



Product special requirements:

1. Single sided board: use 94V0 (flame-retardant paperboard, die punching) 1.6M thick flame retardant paperboard (if the sheet is thin, over 260. C high temperature peak furnace will be deformed);

2. The overall solder width (W) needs to be greater than 2/3 of the PCB welding pad width (P).

3. Half-side tin and the surface is tin-free are not allowed.

4. Damaged components are not allowed.

5. Do not allow the circuit to have exposed copper. The deformation of the PCB should not exceed 2mm.

 

Double sided PCBcircuit board pcb




circuit board pcb



Features of communication data acquisition products:

1. High-precision data acquisition, input and output isolation, communication isolation, and surge protection.

2. Conversion speed >=1V voltage range standard 160Hz 1V voltage and 20mA current range standard 80Hz (conversion speed factory optional).

3. Can meet most industrial sites and security, intelligent buildings, smart home, electrical power monitoring and control, process control and other occasions.



Multilayer PCB




Why do customers choose us?

A: The customer asks what the production process is and whether can guarantee the accuracy of the shipment.

Our production process is very standardized. First, after receiving the customer's quotation information, our process is:

1) Review the GERBER data and bill of materials provided by you to make our internal production documents

2) Warehouse material inventory and IQC incoming material inspection

3) Preparation before production, PCB board baking, placement machine programming, inspection equipment programming

4) Inspection of quality personnel in each process

5) DIP soldering, washing boards, packaging, storage, shipping


Why do customers choose us?



Equipment used in the production process

1.X-ray tester

2. Burn tester

3. Semi-automatic printing equipment

4.Reflow soldering

5. Sending board equipment

6. Material counting equipment

7.Material inspection equipment

The following is a partial bitmap of the product:



PCB multilayer production


Cooperation case:


Cooperation case


Cooperation case

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