Rigid circuit boards assembly

Rigid circuit boards assembly

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Product Details

Rigid circuit boards assembly

Product Classification: PCBA

Product Name: Main Control Board

Production process: lead-free process

Process flow: smt+dip+ packaging

Pcb industry application: civil aviation products

Pcb sheet information: size: 92.71 * 96.52MM four layers of FR4, board thickness 1.6MM, copper thickness 1OZ, lead-free spray tin, green oil white.

Order Quantity: Sample 5pcs

IQC furnace experiment: all self-purchased plastic molded patch materials have to be reflowed


PCB (2)


Material inspection standard for products: General standard implementation PC-610E-2

Double-sided mounting of the circuit board: U3 surface first paste GX1 bit number patch optocoupler HCNR201-500E/300E temperature coefficient is only 240 degrees, changed to DIP post soldering manual soldering

Reflow soldering setting: preheating and constant temperature zone operation according to "reflow furnace temperature management specification reflow soldering maximum temperature between 245-247 degrees, super 230 °C welding time control 40-60S

Welding method of dip process: hand soldering, soldering iron temperature 370-390 degrees, penetrating tin 50%, GX1 tag patch optocoupler HCNR201-500E/300E temperature coefficient is only 240 degrees, changed to DIP post soldering manual soldering


PCB prototype

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