Aluminum PCB Assembly For Industrial Electronic Products

Aluminum PCB Assembly For Industrial Electronic Products

This Aluminum PCB Assembly For Industrial Electronic Product is your preferred material when you are looking for electronic substrate with high thermal conductivity and low thermal expansion coefficient (CTE).

Product Details

Description

This Aluminum PCB Assembly For Industrial Electronic Product is your preferred material when you are looking for electronic substrate with high thermal conductivity and low thermal expansion coefficient (CTE).

This Aluminum PCB Assembly For Industrial Electronic Products have been widely used in microelectronic components and power LED packaging substrates and increasingly they are replacing entire printed circuit boards with reduced design and manufacturing complexity while improving performance. It can be applied on-board chip (COB) modules, high-power circuits, proximity sensors, battery drives for electric vehicles, etc.


Features

-Lower system costs: reduced testing, plug-in components.

-Good sealing: The cost effective dense package has a 0% water absorption rate due to the parallel processing of the sealing package by the layers.

-Application: Aluminum PCB Assembly For Industrial Electronic Products is widely used in communication antenna, automobile power control module, AC converter, optical converter, igniter, dc-ac converter, switching machine, solid state relay, rectifier bridge, high-power LED, etc.


Our Adavantages

1.Surface Mount Technology

2.Through-Hole Assembly Technology

3.Mixed Assembly Technology

4.Conventional Leaded Technology

5.Special Processes

6.RoHs certification

7.Inspection Methods

9.Prompt and Superior Service

8.Conformal coating

9.Prompt and Superior Service


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Article

Description

Capability

Material

Laminate materials

FR4,Alu,CEM3,Taconic,Rogers

Board cutting

Number of layers

1-58

Min. Thickness for inner layers 

(Cu thickness are excluded)

0.003”(0.07mm)


Board thickness

Standard

0.04-0.16”±10%(0.1-4mm±10%)

Min.

Single/Double layer: 0.008±0.004”


4 layer: 0.01±0.008”



8 layer: 0.01±0.008”



Bow and twist

<7/1000


Copper weight

Outer Cu weight

0.5-4 oz

Inner Cu weight

0.5-3 oz


Drilling

Min size

0.0078” (0.2mm)

Drill deviation

±0.002” (0.05mm)


PTH hole tolerance

±0.002” (0.005mm)


NPTH hole tolerance

±0.002” (0.005mm)


Plating

Min hole size

0.0008” (0.02mm)

Aspect ratio

20 (5:1)


Solder mask

Color

Green,white,black,red,yellow,blue...

Min solder mask clearanace

0.003” (0.07mm)


Thickness

0.0005-0.0007”(0.012-0.017mm)


Silkscreen

Color

White,black,yellow,red,blue...

Min size

0.006” (0.15mm)


E-test

Flying Probe Tester

Y

Controlled Impedance

Tolerance

±10%

Impedance tester

Tektronix TDS8200


Surface Finish

HASL,ENIG,immersion silver,immersion tin,OSP...



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