This Double Sided FR4 Gold Immersion Finish PCB presents a design that can optimize LED heat transfer and low cost printed circuit method of PCB layout. This method needs to be used Fr-4 based printed circuit board, printed with metal core circuit board (MCPCB).
Compared to normal circuit board, Double Sided FR4 Gold Immersion Finish PCB is lower, but the overheating resistance is greater. Under the LED heat conducting pad, the use of a metal lined hole or through hole is a method of heat dissipation, which can be dissipated through Fr-4 by dispersing COr through a circuit board to the corresponding heat sink.
Process of Double Sided FR4 Gold Immersion Finish PCB
Electroless nickel/gold impregnation is not as simple as the OSP process, which requires a thick coating on the copper surface. Unlike the OSP, it only serves as a rust-proof barrier layer and the nickel-gold alloy with good electrical properties can protect the PCB for a long time and achieve good electrical properties. In addition, it also has the environmental tolerance that other surface treatment processes do not have, effectively preventing PCB board damage.