Automotive pcb board assembly
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them.
The PoP technology occurs to cater to electronics industry's constantly demands of fine pitch, smaller size, high signal processing speed and smaller mounting real estate towards electronic products such as smart phones and digital cameras. When applying this technology in the PCB assembly process, electric connection occurs between memory devices at upper package and logic devices at lower package, those devices can even be tested and replaced alone. All of these features help reduce PCB assembly costs and complexity.
There're two widely used PoP structure, namely Standard PoP Structure and TMV PoP Structure.
Now we are mainly discuss about Standard PoP Structure.
In a standard PoP, logic devices are placed at the bottom package and logic devices feature a structure of fine pitch BGA solder in harmony with device's attribute of a large number of pin counts. The top package in the structure of a standard PoP contains memory devices or stacked memories. Owing to insufficient pin counts memory devices contain, margin array can be applied so that interconnections between memory devices and logic devices at the margin of two packages.
Currently in FASTPCBA we have an order with this POP technology. Before assembly,the Front-end engineers discussed and came up with some ideas as to how to solder two BGA together before assemble them onto boards. What’s the result? Will they be success? Let’s keep an eye on that and keep you posted!