Board thickness: 0.6 to 3mm
Maximum panel size: 550 x 660mm
Minimum hole diameter: 0.35mm
Minimum line width and space: 0.1mm
Surface: immersion gold and HASL
Twist and warp less than 1%
Process information for the product:
Production process: leaded process
The process of the production process is: SMT+DIP
Solder paste requirements: Ag0.3/Cu0.7/20-38uM
Double-sided patch: Priority production U17 digit surface The heavier component should be evaluated with a red pulse, and the pen will be dropped when it passes through the furnace.
SMT welding requirements: 1. Sampling U5 position master printing and post-furging effect;
2 The position of the empty pad cannot be tinned (use a piece of adhesive tape to seal the large area where the parts are not attached as shown in the circle below)
3. Produced by lead-free process, PCB, etc. may be leaded, and the maintenance of the iron head is separated.