Aluminum pcb custom pcb fabrication
|Material||Laminate material||FR4, Alu, CEM3,Taconic,Rogers|
|Board cutting||Number of layers||1-58|
Min.Thickness for inner layers
(Cu thickness are excluded)
|Bow and twist||<7/1000|
|Copper weight||outer Cu weight||0.5-4 oz|
|inner Cu weight||0.5-3 oz|
|PTH hole tolerance||±0.002''(0.005mm)|
|NPTH Hole tolerance||±0.002''(0.005mm)|
|Plating||Min hole size||0.0008''（0.02mm）|
|Aspect ratio||20(5 :1)|
|Min solder mask clearance||0.003''(0.07mm)|
|E-test||Flying probe tester||Y|
soldering printed circuit boards through hole is generally divided into three major categories: welding, pressure welding and brazing.
Fusion welding refers to the method of heating the weldment joint to the molten state during the welding process and completing the welding without pressure, such as arc welding, gas welding, laser welding, plasma welding, and the like.
Pressure welding refers to the method of adding welding (heating or not heating) to the welding part during welding, such as ultrasonic welding, high frequency welding, electric resistance welding, pulse welding, friction welding, etc.
Brazing is to use a metal material with a lower melting point than the base material as a solder to heat the weldment and the solder to a temperature higher than the melting point of the solder but lower than the melting point of the base material. The liquid solder is used to wet the base material, fill the joint gap, and The method in which the base materials are mutually diffused to connect the weldments.
soldering printed circuit boards through hole material is tin-lead alloy. Its melting point is relatively low. The melting point of eutectic solder is only 183 °C. It is the most common welding technology used in the electronics industry.
Soldering has the following characteristics:
(1) The melting point of the solder is lower than the melting point of the weldment.
(2) When welding, the weldment and the solder are heated to the optimum soldering temperature, the solder is melted and the weldment is not melted.
(3) The formation of the solder depends on the molten state to wet the soldered surface, and the capillary enters the gap by capillary action to form a bonding layer, thereby achieving the bonding of the weldments.