Aluminum pcb custom pcb fabrication

Aluminum pcb custom pcb fabrication

soldering printed circuit boards through hole material is tin-lead alloy. Its melting point is relatively low. The melting point of eutectic solder is only 183 °C. It is the most common welding technology used in the electronics industry.

Product Details


Aluminum pcb custom pcb fabrication

Specification:

Aticle

Description

Capability

Material

Laminate material

FR4, Alu, CEM3,Taconic,Rogers

Board cutting

Number of layers

1-58

Min.Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)

Board thickness

Standard

0.04-0.16''±10%(0.1-4mm±10%)

Min

Single/Double layer:0.008±0.004''

Bow and twist

<7/1000

Copper weight

outer Cu weight 

0.5-4 oz

inner Cu weight 

0.5-3 oz

Drilling

Min size

0.0078''(0.2mm)

Drill deviation

±0.002''(0.05mm)

PTH hole tolerance

±0.002''(0.005mm)

NPTH Hole tolerance

±0.002''(0.005mm)

Plating

Min hole size

0.0008''(0.02mm)

Aspect ratio

20(5 :1)

Solder mask

Color

Green,white,black,red,yellow,blue

Min solder mask clearance

0.003''(0.07mm)

Thickness

0.0005-0.0007''(0.012-0.017mm)

Silkscreen

Color 

Green,white,black,red,blue....

Min size

0.006''(0.15mm)

E-test

Flying probe tester

Y


Description:

Product basic information:

Goods classification: PCBA

pcb layers: 14 layers FR4

pcb board thickness: 2.54MM

Copper thickness: 1OZ

Process: Shen gold, blue oil white letters

Single piece size: 59.94 * 66.45MM

Industry application of pcb board: fitness equipment

Order quantity: 800pcs



PCB (2)


Soldering printed circuit boards through hole material is tin-lead alloy. Its melting point is relatively low. The melting point of eutectic solder is only 183 °C. It is the most common welding technology used in the electronics industry.

Soldering has the following characteristics:

(1) The melting point of the solder is lower than the melting point of the weldment.

(2) When welding, the weldment and the solder are heated to the optimum soldering temperature, the solder is melted and the weldment is not melted.

(3) The formation of the solder depends on the molten state to wet the soldered surface, and the capillary enters the gap by capillary action to form a bonding layer, thereby achieving the bonding of the weldments.


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