Circuit board led manufacturer light tube pcb
The LED circuit board is made of an aluminum-based material and is a metal-based copper plate with good heat dissipation. In general, a single panel consists of three layers, a circuit layer (copper foil), an insulating layer, and a metal base layer. Common in LED lighting products. There are two sides, the white surface is soldered to the LED pins, and the other side is the color of aluminum, which is usually applied after thermal coagulation and contact with hot parts. Ceramic substrate, etc.
LEDs can be used for many purposes. Among them, high-end applications are also designed as double-sided panels. The structure is circuit layer, insulation layer, aluminum base, insulation layer and circuit layer. Very few applications are multi-layered, can be made with ordinary multi-layer board FR4 pcb with insulation layer and aluminum base plate
LED aluminum substrate is PCB, which is also the meaning of printed circuit board, only the material of the circuit board is aluminum alloy. Before, the material of general circuit board is glass fiber, but because of the high temperature of LED, the circuit board used for LED lamps is generally aluminum substrate, which can conduct heat fast. The circuit board used for other equipment or electrical appliances is also glass fiber board！
Compared with the traditional FR-4 ratio, aluminum substrate can reduce the thermal resistance to the minimum, so that aluminum substrate has excellent thermal conductivity.Compared with the thick - film ceramic circuit, its mechanical properties are excellent.
In addition, aluminum substrate has the following unique advantages:
Comply with RoHs requirements;
More suitable for SMT process;
The thermal diffusion is treated effectively in the circuit design scheme, so as to reduce the operating temperature of the module, extend the service life, and improve the power density and reliability.
Reduce the assembly of radiators and other hardware (including thermal interface materials), reduce product volume, and reduce hardware and assembly costs;Optimize the combination of power circuit and control circuit;
Replace fragile ceramic substrate for better mechanical durability.
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