PCB assembly High Frequency Antenna

PCB assembly High Frequency Antenna

High Frequency Antenna PCB features lower dielectric loss, reduced signal loss, lower cost of circuit fabrication and better suitability for fast-turnaround prototyping applications. High Frequency Antenna PCB is made of epoxy glass fiber (FR-4). Besides, for the double layers PCB, there are coatings of copper clad laminates at top and bottom layer.

Product Details

Basic information about the product:

Board Name: gerber_files_and_nc_drill (Squash Cannon)

Board Code: 2G2303A0-PCBA

Circuit board use: high frequency antenna

Pcb sheet information: size: 145*90MM double sided FR4, board thickness 1.6MM, copper thickness 1OZ, lead-free spray tin, green oil white, single piece size 145*90MM

Order Quantity: 500pcs

Production cycle: 3 days


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PCB (2)



Product process description:

Production process: lead-free soldering

Process flow: SMT+dip

Material baking: follow the "SMT parts baking operation guide"

Special requirements: Special requirements 1.400, U401 IC should be welded straight, do not skew.

Welding method: wave soldering, wave soldering temperature 255-257 degrees, tin penetration 50%, pay attention to the furnace, the interface and pin headers should be pressed with the edge of the plate, | prevent the furnace from floating high. Note that the socket cannot be raised.

Circuit board cleaning method: electrostatic brush hand wash, be careful not to corrode


PCB prototype


Product sindustry application

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