Pcb assembly components are basically sheet-like structures, but the sheet shape is a generalized concept. According to the shape of the structure, the Pcb assembly components can be divided into rectangular sheets, cylindrical shapes, flat shaped shapes, and the like. According to the function, Pcb assembly components can be divided into three categories: passive components (SMC), active components (SMD) and electromechanical components. Depending on the function of the components on the circuit, the electromechanical components can also be classified as SMC. In the use environment, Pcb assembly components can be divided into non-hermetic package devices and hermetic package devices. Non-hermetic package devices generally have operating temperature requirements of 0°C-70°C, and the operating temperature range of hermetic package devices. It can reach -55 ° C ~ 125 ° C, airtight package devices are expensive, generally used in military and other high reliability products.
Pcb assembly passive components (SMC)
Rectangular chip: thick film and thin film resistors, thermistors, varistors, single or multi-layer ceramic capacitors, tantalum electrolytic capacitors, chip inductors, magnetic beads, quartz crystals, etc.
Cylindrical: carbon film resistors, metal film resistors, ceramic capacitors, thermal capacitors, etc.
Heterogeneity: trimmer potentiometer, tantalum electrolytic capacitor, trimmer capacitor, wirewound inductor, transformer, etc.
Composite chip: resistor network, capacitor network, filter, etc.
Pcb assembly active components (SMD)
Ceramic components (flat): leadless ceramic chip carrier, ceramic ball grid array
Plastic components (flat): small outline transistors, small outline package, plastic packaged lead chip carrier, quad flat package, plastic ball grid array, etc.
Electromechanical components, the opposite sex: relays, switches, connectors, retarders, thin micromotors, etc.