(1) A narrow smooth wave. It helps to eliminate most of the bridging phenomenon, but solder joints with large heat capacity (thick lead) may increase bridging due to insufficient heat. How to meet the welding requirements of different thickness leads becomes a difficult point in the control of wave soldering process.
(2) Wide smooth wave. Suitable for the welding of large heat capacity plates (or solder joints), the solder joints are also full, but there will be more bridges.
(3) Smooth wave with extension, suitable for efficient production. Since the separation of solder joints and waves is slow vertical separation, slower speeds tend to produce more bridging.
(4) The way in which tin waves are generated mainly consists of mechanical (pulse) and electromagnetic (early electromagnetic waves are often not high, which is a deficiency).
It can be seen from the above analysis that no single technology is suitable for all plate types. To improve the quality of wave soldering, it is necessary to pay attention to the optimization of DFM and process. It should also be remembered that the setting or experience of each process parameter must be determined based on the waveform of the wave soldering machine and the process characteristics of the PCBA. The appropriate parameters on one device may not be applicable on the other!