The Difference Between SMT And THT

- Dec 27, 2018-

The so-called surface assembly technology refers to the chip structure of components or suitable for surface assembly of miniaturized components, in accordance with the requirements of the circuit placed on the surface of the printed board, with reflow welding or wave soldering and other welding processes assembled, forming a certain function of electronic components assembly technology.The differences between SMT and THT component installation and welding are shown in the figure.

In the traditional THT printed circuit board, the components and solder joints are located on both sides of the board.On SMT circuit board, solder joints and components are on the same surface of the circuit board.Therefore, in SMT welding machine printed circuit board, through hole is only used to connect the circuit board on both sides of the wire, the number of holes is much smaller, hole diameter is much smaller.In this way, the circuit board assembly density can be greatly improved.


SMT surface-mounted components are functionally no different from plug-in components, except in their packaging.Surface-mounted packages that undergo high temperatures during welding must have components and substrates with matching thermal expansion coefficients.These factors must be taken into account in the design of a product.

SMT technology

The characteristics of SMT technology can be reflected by the difference between SMT and THT.From the perspective of assembly technology, the fundamental difference between SMT and THT is "paste" and "insert".The differences are also reflected in the substrate, components, component morphology, solder joint morphology and assembly process.

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