Selective wave soldering has certain requirements for PCB design. In order not to affect the adjacent components on the PCB board, it is necessary to leave a soldering channel around the solder joints selected for soldering. How is the distance between adjacent components designed reasonably? FASTPCBA technology answers for you as below:
The components to be soldered should be programmed before pcb production when performing selective wave soldering . The distance between the adjacent solder joint edges, components and soldering nozzle of the board should be greater than 5~6mm. While the thickness of the component body is less than 4mm, the distance between the component and the nozzle can be less than 6mm; when the height of the component body is greater than 15~20mm, the distance between the component and the nozzle should be greater than 6mm, as shown in Figure 1. Which is important for the stability of the craft. The dip soldering selective soldering craft can solder joints range from 0.7 to 10 mm. The soldering craft of short pins and small size welding pads are more stable, and the possibility of bridging connection the board is also smaller.
Therefore, selective wave soldering has certain requirements on the pitch design of adjacent components of the PCB. The above is the information provided by FASTPCBA.