Learn About The PCB Manufacturing Technology’s Development Trend

- Jul 29, 2019-

Nowadays , pcb manufacturing technology is not only advanced in the production of high-precision,but also in multi-lamination functional technologies. Let's learn about the development trend of the latest pcb manufacturing technology in 2019.

 

1.In 2019, the printed circuit board continued to improve, and the welding technology continued to surpass. The PCB manufacturing technology should adapt to the ultra-high-density assembly and high speed requirements. For example, a flip chip requires wire width of 11 μm, wire pitch of 4 μm, and three wires in the pad, which exceeds the PCB manufacturing capability, and cannot be realized via conventional subtractive technics . However, the usage of a semi-additive techinics has now been used, which requires the using of sputtering equipment. Another example is the application of CAD-inkjet system, multi-layer board manufacturing technology (BUM). In 2019, microvias of less than 10μm or even 5μm on the pcb pad can be realized by plasma etching and drilling technology, and it is also the most advanced technology for circuit board etching.

 

pcb manufacturer


2.In order to adapt to the assembly of composite pcb, PCB manufacturing technology is closely integrated with semiconductor technology and SMT assembly technology. In the technology of embedding R. C, H, filters and other components into the PCB, such as how to control the extremely strict R, CH tolerance requirements, how to detect, improve material properties, reduce costs, etc., that must be studied in the PCB manufacturing production process.

 

3. It should adapt to the PCB assembly requirements of new functional components.

 

4.It should adapt to lead-free soldering high temperature resistance and PCB pad surface coating material lead-free requirements.


In short, the technical level of printed circuit boards is developing in the direction of high-precision, high-density, ultra-thin multilayer printed circuit boards, embedded passive components and active devices in substrates.




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