In the SMT patch factory, the control points and methods of temperature and humidity sensitive components
In order to ensure the correct use of temperature and humidity sensitive components during smt patching, and prevent smt patching components from being affected by moisture, humidity and influence in the environment and using anti-static packaging materials, the following points can be effectively managed and controlled to avoid improper control of materials And affect the quality.
(1) Environmental control.
The temperature and humidity sensitive components are used in the workshop. The ambient temperature is between 18~28℃, and the relative humidity is between 40%~60%; during storage, the relative humidity of the moisture-proof box is <10%, and the temperature is between 18~28℃; the material staff every 4 hours Check the temperature and humidity of the moisture-proof box once, and register its temperature and humidity value in the ``Temperature and Humidity Control Table''; if the temperature and humidity exceed the specified range, immediately notify the relevant personnel to improve, and take corresponding remedial measures (such as placing desiccant, adjusting Room temperature or remove the components from the faulty moisture-proof box and put them into a qualified moisture-proof box). The open time or door open time of the temperature and humidity environment of each enclosed area should not exceed 5 minutes to ensure that the temperature and humidity conditions can continue to be within the control range.
(2) Process control.
a. When unpacking the vacuum packaging of humidity sensitive components on the Smt patch production line, you must wear an electrostatic wristband and electrostatic gloves, and open the vacuum package on a table with good electrostatic protection. After disassembly, check whether the humidity card changes meet the requirements (according to the label requirements on the packaging bag). For smt chip ICs that meet the requirements, add the "Humidity Sensitive Component Control Label" on the packaging.
b. When the production line receives bulk humidity sensitive components, it shall confirm whether the components are qualified according to the "Humidity Sensitive Components Control Label", and give priority to the qualified components.
c. After unpacking the humidity sensitive component (IC), the exposure time in the air before reflow shall not exceed the humidity sensitive component level and life.
d. For ICs that need to be baked and unqualified, hand them to the quality control staff for rejection and return them to the warehouse.
(3) Control method
a. Feeding inspection———the moisture-proof bag should be accompanied by a desiccant bag and a relative humidity card, and relevant text warning slogans should be affixed to the outside of the moisture-proof bag. If the packaging is not good, it needs to be confirmed by relevant personnel.
b. Material storage-Unopened materials should be stored in accordance with the instructions; unopened materials need to be returned for storage, after baking, put in moisture-proof bags and vacuum sealed; unopened materials should be temporarily stored in a low-temperature oven if they are not used immediately.
c. On-line operations-unpacking during use, and checking and filling in the humidity indicator card at the same time; filling in the refueling control card and indicating the symbol of the temperature and humidity sensitive component when refueling; the returned materials are dehumidified according to the storage regulations and packed according to the corresponding requirements. Store.
d. Dehumidification operation-select the baking conditions and time according to the humidity level of smt components, environmental conditions, and opening time.
The above are the key points and methods for the control of temperature and humidity sensitive components in the SMT chip factory provided by Jingbang. I hope you can help!