FASTPCBA Factory Audit 28 Indicators All Meet The Standards

- Sep 09, 2020-

Is there an operator Work Instruction (WI) for each manufacturing processes?是否有WI? ■ √

Is the WI(Work Instruction) revised and updated?WI版本是否更新?□ ■ √

Is the operator wearing ESD wrist strap in handling ESD sensitive materials? 操作者拿ESD敏感部品是否带静电手腕带?□ ■ √

Does the machine & equipment are grounded?机器和设备是否接地?□ ■ √

Is the component FIFO controlled in the storage bins? How?干燥箱里的部品是否控制先进先出?如何控制?□ ■ √

Is component stock controlled in the warehouse?仓库里的部品存放是否控制?□ ■ √

Is the room temprature & humidity controlled?室内是否有温湿度控制?□ ■ √

Is the moisture prevention countermeasure of IC type established?是否有IC防湿的预防措施?□ ■ √

Are measurement instruments calibrated by periods?是否定期校验测量工具?□ ■ √

Solder Paste Printer焊膏丝印

Is the storage fridge temperature of Solder Paste controlled?是否对存放焊膏的电冰箱温度进行控制?□ ■ √

Is the Solder Paste FIFO controlled in the storage fridge? 电冰箱里存放的焊膏是否进行了先进先出的控制?如何控制?□ ■ √

Is the expiry date of the Solder Paste controlled?是否对焊膏 的有效期进行控制?□ ■ √

Is the Solder Paste agitator used?焊膏是否搅拌使用?□ ■ √

Does the Screen Print machine have the capability to automatically clean the solder mask? 丝印机器是否有自动清洗钢网的能力? □ ■ √

Standard chip mounter 标准部品贴装

Is the component loading set-up cross checked by another operator before machine start up?开机前是否有作业者相互对资材上料进行交叉检查? □ ■ √

Is the repair history of feeder controlled?进料器的维修历史记录是否被控制? □ ■ √

Is the nozzle cleaning implemented by periods?吸嘴是否定期进行完全清洁? □ ■ √

Odd chip mounter 异型部品贴装

Is the component loading set-up cross checked by another operator before machine start up?开机前是否有作业者相互对资材上料进行交叉检查? □ ■ √

Is the repair history of feeder controlled?进料器的维修历史记录是否被控制? □ ■ √

Is the nozzle cleaning implemented by periods?吸嘴是否定期进行完全清洁? □ ■ √

Is the loading direction of components specified?是否规定了部品的装载方向? □ ■ √

Vision Inspection (pre / post Reflow)目检

Is the visual inspection implemented using magnifier?目检是否使用放大镜? □ ■ √

Is there AOI tested component ? 是否有AOI测试部品? □ ■ √

Is OK & NG PCBA seperated each location? Ok与NG的PCBA 是否区分摆放? □ ■ √

Reflow Soldering回流焊

Is there evidence that a Temperature Profile is conducted on daily basis? 是否有证据表明温度曲线每日常规检查都管理? □ ■ √

Is there temperature profile check jig each model?是否每个型号都有温度曲线检查JIG? □ ■ √

Have at least three thermocouples been used at various points on the board to establish the Profile? 是不是有3个热电耦使用在板子上的不同点来确定曲线? □ ■ √

Does the VDU displayed temperature set points / belt speed match those on the current Temperature Profile?当前的温度曲线是否符合VDU 温度设置? □ ■ √


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