The role of AL PCB separate thermoelectric separation

- Sep 18, 2018-

Thermal conductive fault - based circuit board manufacturing method, it not only made accuracy .Effectively improve the practicability and durability of the product, and made of aluminum based circuit board performance stability, and achieve rapid and ultra-high thermal conductivity of the effect.


The invention discrete thermoelectric separation ALPCB composition of the process of metal heat dissipation substrate and conductor in the same plane, in SMT, lamp bead components such as electrical pins can be welded on the circuit conductor of bonding pad, the lamp bead components such as cooling tower was directly welded on metal substrate heat dissipation, the heat generated by the components can be directly through the metal heat dissipation substrate synchronous fast export to transfer at any time.

In this way, the thermal conductivity of the product can reach more than 200W/ m.k, which is dozens or even hundreds of times higher than the traditional ALPCB nowadays.Separated thermoelectric separation of ALPCB can be used in SMD lamp bead process or chip bonding process.

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