As the pin pitch continues to shrink, the bridging rate of wave soldering is getting higher and higher, especially the bridging phenomenon between connectors is particularly obvious. The tight-fitting connector pads are detached from the solder paste end without the force to tow away the molten solder.

improvement measures:

(1) Layout direction: The length direction of the pad connector of the circuit board is parallel to the direction of the PCB over-peak transmission.

(2) Pin extension length: The extension length is controlled within the range of 0.5 to 0.8 mm.

(3) Use a stolen tin pad.

(4) Optimize the process parameters of wave soldering. Among them, the thief solder pad has a confirmed and obvious effect on eliminating the bridging of the pin-off pin. The so-called stolen tin plate refers to the process pad that is placed on the pin-off end of the pin and used for dragging tin. It has various designs.