The wave soldering process is a very important part of the entire PCBA manufacturing process. Even if this step is not done well, all the front-end efforts will be wasted. And it takes a lot of energy to repair, so how to control the wave soldering process? I think any problem must be considered beforehand, and all preparations must be done before starting.
Today, the editor of FASTPCBA Electronics will analyze with you what preparations the factory must do before wave soldering?
1. Check the PCB to be soldered (the PCB has been coated with SMD glue, SMC/SMD SMD glue and solidified and completed the THC insertion process) and whether the solder resist is applied to the soldering surface and gold fingers of the component sockets Or stick it with high temperature resistant tape to prevent the socket from being blocked by solder after wave soldering. If there are slots and holes of larger size, they should also be attached with high temperature resistant tape to prevent the solder from flowing to the upper surface of the PCB during wave soldering. (The water-soluble flux should be a liquid solder resist. After coating, place it for 30 minutes or bake under a light for 15 minutes before inserting the components. After soldering, it can be washed directly with water.)
2. Use a density meter to measure the density of the flux. If the density is too high, dilute it with a thinner.
3. If using traditional foaming flux, pour the flux into the flux tank.
These three steps are actually the work that must be done before the entire wave soldering process, and as an smt chip processing plant, the process file should be written first in the process control. Choose fastpcba for high-end circuit board, quality assurance, word of mouth.