Surface Mount Technology (SMT), also known as surface mount technology, is a new generation of electronic assembly technology that compresses traditional electronic components into components that are only a fraction of a tens of volume, enabling high-density assembly of electronic products. High reliability, miniaturization, low cost and automation of production. The process of assembling these components onto the circuit is called the SMT process, and the associated assembly equipment is called the SMT device. At present, advanced electronic products, especially computer and communication electronic products, have generally adopted SMT technology. International production of surface-mounted components has increased year by year, while the output of traditional components has been declining year by year, so SMT technology will become more and more popular over time.
Surface mount technology is one of the most popular technologies and processes in the electronics assembly industry. It has the following features.
(1) The assembly density is high, the electronic product is small in size and light in weight, and the size and weight of the chip components are only about 1/10 of that of conventional plug-in components. After SMT is generally used, the volume of electronic products is reduced by 40%-60%, and the weight is reduced by 60%-80%.
(2) High reliability, strong seismic resistance, and low defect rate of solder joints.
(3) Good high frequency characteristics, reducing electromagnetic and radio frequency interference.
(4) It is easy to automate, improve production efficiency and reduce costs.