Since the development of surface assembly components, many kinds of SMC/SMD have been used in the production of electronic products. IC pin spacing has developed from 1.27 mm to 0.8 mm, 0.65 mm, 0.4 mm and 0.3 mm. SMD has developed from SOP to BGA, CSP and FC. The guiding principle is that the more I/O, the better. In order to minimize the system delay on the chip, the chip packaging should be closer and the distance between the chips should be smaller. Therefore, semiconductor components are developing towards multi-pin, light weight, small size and high speed.
New components have many advantages. For example, CSP is not only a chip-level package size, but also a recognizable high-quality chip (KGD), small size, light weight, ultra-thin (second only to FC), but also has some problems, especially whether it can adapt to mass production. Components with a new packaging structure can not be called good packaging components if they can not solve the problem of industrial electronic products production, even if they have infinite superior performance. CSP is due to its complex fabrication process, i.e. the use of microporous substrates in CSP fabrication, otherwise it is difficult to realize the interconnection between chips and component boards, which restricts the development of surface assembly component technology. The trend of new IC packaging is smaller size, more 10 numbers, better electrical performance, more reliable solder joints, stronger heat dissipation capacity, and mass production.