Bonding, also known as gluing, is the process of bonding components and materials together using a variety of adhesives. Many pcb manufacturers use it for components that cannot be connected in a conventional installation methods.
There are many types of Pcb adhesives, including fast adhesives, epoxy adhesives, hot melt adhesives, pressure sensitive adhesives, photosensitive adhesives etc,.The method of using the adhesive is as follows:
XY401 (often referred to as No. 88 glue), evenly apply a layer of glue on the surface of the component with a brush, place it at room temperature for 5-10 minutes, then stick the two glued faces together, with a pressure iron or special tools to press. The bonding surface should be treated firstly after bonding; after curing 24H at room temperature, the pressurizer can be removed and then dried at the same room temperature for 24 hours.
XY98-1 (resin glue), evenly apply a layer of glue on the surface of the component with a brush, place it at room temperature for 30 minutes, hold it at 50-60 degrees for 15 minutes in a baking oven, and take it out to cool to room temperature. Repeat the operation to ensure that the thickness of the adhesive layer is 0.1-0.28mm, then pressurize and heat up 40-50 degrees in the oven. Before bonding,polish the metal surface with sandpaper, then rub it with alcohol, etc., and dry it; make sure that the adhesive surface is smooth. If it is uneven, apply a few times of glue.
The epoxy resin glue, the epoxy resin 1010 and the curing agent h-4 are evenly mixed in a ratio of 1:1, and the adhesive surface is evenly applied and then bonded and pressurized. The adhesive surface should be cleaned before bonding, and it needs to be placed for 24 hours after bonding. The uncoated epoxy resin should be sealed immediately.