PCB manufacturing assembly, also known as surface mount technology, is a new generation of board assembly technology. It compresses traditional electronic components into devices that are only a few tenths of a volume, enabling high-density, high-reliability, miniaturization, low-cost, and production automation of printed circuit board product assembly. In the narrow sense, Pcb manufacturing assembly is to assemble or paste and solder the components on the surface of the pad to the electronic assembly technology at a predetermined position on the surface of the printed circuit board (PCB).
The PCB used does not require a drill hole. Refining from the process point of view is to first apply solder paste on the PCB pad, and then accurately place the surface-assembled components on the pad coated with solder paste, by heating the PCB until the solder paste is melted, and then cooling The interconnection between components and printed circuits. Broadly speaking, SMT involves chemical and material technologies (such as various solder pastes, fluxes, cleaning agents, various components, etc.), coating techniques (such as coating solder paste or patch adhesive), and precision machining techniques ( Such as coating template production, tooling fixture production, automatic control technology (such as production equipment and production line control), welding technology and testing, inspection technology, various management technologies and many other technologies, is a complex, comprehensive system engineering technology.
Therefore, the basic composition of SMT can be summarized into four major parts: production materials, production equipment and production processes and management. Among them, the production materials and production equipment can be called SMT hardware, and the production process and management software called SMT.