Why do components and soldering plates need to remove moisture?

- Jan 08, 2019-

Circuit board pads and components are vacuum-packed during transportation to prevent the board from getting wet and affect the normal function of the product. However, when components and soldering plates are unpacked, if they are not put into production in time, the components and soldering plates will be damp, and the wet components and soldering plates will be dehumidified before being put into the production line. The solderability and quality of the packaged product.

In actual pcb production, non-vacuum-packaged components are dehumidified at high temperatures and then stored in low-humidity boxes to shorten the dehumidification cycle. For humidity cards, it is recommended to use PBGA low temperature dehumidification instead of high temperature dehumidification. Due to the high temperature and high speed of high temperature dehumidification (over 100 degrees Celsius), if the humidity of the component is too high, it is due to rapid gasification of water. Causes component failure.


There are usually two types of BGA dehumidification, such as low temperature dehumidification and high temperature dehumidification. Low temperature dehumidification is the dehumidification of the low humidity cabinet, and dehumidification is time consuming. Typically, 192 hours are required under 5% humidity conditions. High temperature dehumidification is dehumidification through an oven, and the dehumidification time is relatively short. Usually at 125 degrees Celsius, it takes 4 hours.


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